• Nouveau

Nexcom DTA 1162 Virtualization Networks and Software-Defined Appliance with Intel Atom® SOC C3000

  • Intel Atom® processor C3000 series SoC, BGA type
  • Support Intel® QuickAssist Technology
  • DDR4-2133 ECC or non-ECC memory SO-DIMM, up to 32GB
  • 4 x 1GbE RJ45 & 2 x 1GbE RJ45 for DTA 1162A
  • 4 x 1GbE RJ45 & 2 x 1GbE SFP for DTA 1162B
  • 1 x M.2 2242 storage socket
  • On-board 8GB eMMC 5.0
  • 2 x USB 3.0 connector
  • TPM 1.2/2.0
Main Board DTB1162 seriesIntel Atom® processor C3338 w/o Intel® QAT for DTA 1162AIntel Atom® processor C3558 w/ Intel® QAT for DTA 1162B
Main Memory 1 x DDR4-1866 SO-DIMM ECC/non- ECC memory for DTA 1162A, up to 16GB1 x DDR4-2133 SO-DIMM ECC/non- ECC memory for DTA 1162B, up to 32GB
LAN Features 4 x 1GbE RJ45 (88E1543) & 2 x 1GbE RJ45(Intel® I211) for DTA1162A4 x 1GbE RJ45 (88E1543) & 2 x 1GbE SFP (Intel® I210) for DTA1162BSupport 10/100/1000 link speed
Expansion 1 x M.2 2230 for Wi-Fi module (E-Key)1 x M.2 3042 for LTE module with SIM slot on-board (B-Key)
I/O Interface-Front Power/System/HDD/LAN LEDs1 x SIM slot
I/O Interface-Rear 1 x DC-in1 x Power button2 x USB 3.01 x RJ45 type console port1 x Reset button3 x SMA connector holes for RF cable
Storage Device 1 x 8GB eMMC1 x M.2 2242 M-key socket (SATA)
Power Input DC 12V/3.33A 40W power adaptor
Dimensions Chassis dimension (mm): 225 x 150 x 44Carton dimension (mm): 275 x 230 x 185
Weight Without packing: 1.5kgWith packing: 2.5kg
Environment Operating temperatures: 0°C~40°CStorage temperature: -20°C~80°CRelative humidity: 10%~90% non-condensing
Certifications CE ApprovalFCC Class B
DTA1162