• Nouveau

Nexcom DTA 1376/1376A Arm-Based Desktop uCPE for Wireless Broadband Applications w/ NXP® Layerscape® LS1046A SoC Processor

  • NXP® Layerscape® LS1046A SoC processor, BGA type
  • 1 x DDR4-2133 SO-DIMM ECC socket, up to 16GB
  • 1 x M.2 2242 NVMe SSD
  • 7 x 1GbE RJ45 ports
  • 1 x M.2 3042/3052 for 4G LTE/5G (FR1) module
  • 1 x mini-PCIe slot for Wi-Fi 5 module
  • PoE++ PD (DTA 1376A)

DTA 1376 is a cost-effective Arm-based uCPE in compact design with seven 1GbE copper ports and additional support for wireless connectivity. Powered by NXP® Layerscape® LS1046A SoC processor, with quad 64-bit Arm® Cortex®-A72 cores, DTA 1376 supports DPAA (data path acceleration architecture) to provide a set of networking acceleration to small and medium enterprises. DTA 1376A SKU operates as PoE PD (powered device) to extend from indoor to semi-outdoor usage where power outlet is not accessible.

 

4G LTE   5G   Wi-Fi 5   PoE

DTA 1376 (P/N: 10TA0137600X0)
NXP® Layerscape® LS1046A processor, SoC, BGA type, 4 Cortex-A72 cores, 1.8GHz, 7 x 1GbE RJ45 ports

 

DTA 1376A (P/N: TBC)
NXP® Layerscape® LS1046A processor, SoC, BGA type, 4 Cortex-A72 cores, 1.8GHz, 7 x 1GbE RJ45 ports, with PoE++ PD function supported

Main Board NXP® Layerscape® LS1046A SoC processor, BGA type, 4 Cortex-A72 cores, 1.8GHzSupports DPAA
Memory 1 x DDR4 2133 SO-DIMM ECC socket, up to 16GB
Storage 1 x SPI NOR Flash 64MB for U-Boot1 x M.2 2242 Key M, supports NVMe SSD with PCIe Gen3 x21 x Micro SD slot (optional)
LAN Features 7 x 1GbE RJ45 ports
Interface External SW1/SW2/SW3/power LEDsEthernet LED: active/link speed2 x USB 3.01 x Nano sim slot1 x DC-in 12VDC1 x Power button1 x RJ45 console port1 x Reset button6 x SMA connectors (sides: 4 x for 4G LTE/5G antennas, back: 2 x for Wi-Fi 5 antennas)7 x 1GbE RJ45 ports
Interface internal 1 x mini-PCIe for Wi-Fi 5 module1 x M.2 3042/3052 for 4G LTE/5G FR1 module1 x M.2 2242 Key M for NVMe SSD1 x Micro SD slot (optional)
Power 1 x 40W 12V AC power adapter1 x RJ45 port for PoE++ PD (DTA 1376A)
Dimension and Weight Chassis dimension (mm): 225mm x 150mm x 44mm (W x D x H)Package dimension(mm): 343 x 258 x 212 (W x D x H)Without packing: 1.5kgWith packing: 2.5kg
Environment Operating temperature: 0°C~40°CStorage temperature: -20°C~80°CRelative humidity: 10%~90% non-condensing
Certification CE/FCC class BLVD
Software Development Kit NXP® Layerscape SDK 20.04-NEXCOM DTA 1376 revision
DTA 1376/1376A