AS-2124GQ-NART+ Supermicro Server

Key Applications- AI/ML, Deep Learning Training and Inference
- High-performance Computing (HPC)
- Cloud Computing
- Research Laboratory/National Laboratory
- Autonomous Vehicle Technologies
- Molecular Dynamics Simulation
 Key Features

1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)

2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)

3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect

4.On board BMC supports integrated
IPMI 2.0 + KVM with dedicated 10G LAN

5.Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)

6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs

7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)

8.4 Hot-swap 2.5" drive bays
(SAS/SATA/NVMe Hybrid)

9.3000W Redundant Titanium Level (96%+) Power Supplies
(full redundancy based on 40GB HGX A100 4-GPU configuration ONLY and application load)

 

Product SKUs
AS -2124GQ-NART+
  • A+ Server 2124GQ-NART+ (Black)
Motherboard

Super H12DSG-Q-CPU6
Processor/Cache
CPU
  • Dual AMD EPYC™ 7003/7002 Series Processors
    (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
  • Socket SP3
  • Supports CPU TDP up to 280W*
Cores
  • Up to 128 Cores (64 per CPU)
Note * Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
GPU Support
  • Supports HGX A100 4-GPU 40GB (HBM2) or 80GB(HBM2e) with NVLink GPU interconnect and PCI-E Gen4 host CPUs
GPU
Supported GPUs
  • HGX A100 4-GPU 40GB/80GB SXM4 Multi-GPU Board
CPU-GPU Interconnect
  • PCI-E Gen 4 x16 Direct Connect CPU-GPU Dual-Root
GPU-GPU Interconnect
  • NVIDIA® NVLink™ GPU-to-GPU Interconnect
System Memory
Memory Capacity
  • 32 DIMM slots
  • Up to 8TB 3DS ECC DDR4-3200MH SDRAM
Memory Type
  • 3200MHz ECC DDR4 SDRAM
On-Board Devices
Chipset
  • System on Chip (SoC)
Network
  • Dual RJ45 10GbE-aggregate host LAN, RJ45 1GbE IPMI
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics & System Management
  • ASPEED AST2600 BMC
Input / Output
SATA
  • 4 SATA3 (6Gbps) ports
LAN
  • 2 RJ45 10GbE-aggregate host LAN ports
  • 1 RJ45 1GbE Dedicated IPMI management port
USB
  • 2 USB 3.0 ports (rear)
Video
  • 1 VGA Connector (rear)
Others
  • 1 COM port (header)
  • 1 TPM 2.0 (header)
System BIOS
BIOS Type
  • AMI 256Mb SPI Flash ROM
Management
Software
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmountable
Model
  • CSE-228GTS-R3K02P
Dimensions
Height
  • 3.5" (89mm)
Width
  • 17.2" (437mm)
Depth
  • ~32.7" (830.3mm)
Weight
  • Net Weight: 78.5 lbs (35.6 kg)
  • Gross Weight: 88.5 lbs (40.1 kg)
Package Dimensions
  • 45.5" L x 22.5" W x 11" H
Available Colors
  • Black
Drive Bays / Storage
Hot-swap
  • 4 Hot-swap 2.5" drive bays (SATA/NVMe Hybrid or SAS with optional HBA)
Expansion Slots
PCI-Express
  • 4 PCI-E Gen4 x16 (LP) slots - supporting HGX A100 4-GPU's 1:1 connection to 4 NICs
  • 1 PCI-E Gen 4 x8 (LP) slot
System Cooling
Fans
  • 4 Hot-swap heavy duty fans
 
Power Supply
3000W Redundant Titanium Level Power Supplies
Dimension
(W x H x L)
  • 106.5 x 82.4 x 203.5 mm
Certification Titanium Level96%Titanium Level
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
    10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
    -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)
AS -2124GQ-NART+