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Nexcom DTA 1160 Virtualization Networks and Software-Defined Appliance with Intel Atom® SOC C3758/C3708
- Intel Atom® C3758/C3708 SoC 8 cores, BGA type
- Support Intel® QAT
- Support SR-IOV
- DDR4-2400 ECC/non-ECC UDIMM/RDIMM, up to 64GB
- 2 x 10GbE SFP+ and 6 x 1GbE LAN ports
- 8GB eMMC
- 1 x 2.5” internal SSD bay (optional)
- 2 x USB 3.0 connector
- TPM 1.2/2.0
| Main Board | DTB1160Intel Atom® C3758/C3708, BGA type |
| Main Memory | 4 x DDR4-2400 ECC/non-ECC UDIMM/RDIMM socket; up to 64GB |
| LAN Features | 2 x 10GbE SFP+ ports4 x 1GbE RJ45 ports from Intel® I350-AM42 x 1GbE RJ45 ports from Marvell 88E1543 |
| Expansion | 1 x M.2 2230 slot for Wi-Fi module (E Key) |
| I/O Interface-Front | 2 x USB 3.0 ports (5V/1A)1 x RJ45 type console port2 x SFP+ ports6 x RJ45 ports1 x Power button; 1 x Reset buttonPower/HDD/System/SW LEDsDC jack with lock (12V/5A) |
| I/O Interface-Rear | 3 x SMA holes for Wi-Fi antennas |
| Storage Device | 1 x 2.5” internal SSD bay (optional)1 x SATA connector (for SATA DOM)1 x M.2 2242 SSD socket (SATA & NVMe); M Key |
| Power Input | DC 12V/5A 60W power adaptor |
| Dimensions | Chassis dimension (mm): 240 x 220 x 44Carton dimension (mm): 431 x 301 x 176 |
| Weight | Without packing: 1.9kgWith packing: 3.2kg |
| Environment | Operating temperatures: 0°C~40°CStorage temperature: -20°C~ 80°CRelative humidity: 10%~90% non-condensing |
| Certifications | CE approvalFCC Class BUL |
DTA1160
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- Intel Atom® C3758/C3708 SoC 8 cores, BGA type
- Support Intel® QAT
- Support SR-IOV
- DDR4-2400 ECC/non-ECC UDIMM/RDIMM, up to 64GB
- 2 x 10GbE SFP+ and 6 x 1GbE LAN ports
- 8GB eMMC
- 1 x 2.5” internal SSD bay (optional)
- 2 x USB 3.0 connector
- TPM 1.2/2.0