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Nexcom DTA 1162 Virtualization Networks and Software-Defined Appliance with Intel Atom® SOC C3000
- Intel Atom® processor C3000 series SoC, BGA type
- Support Intel® QuickAssist Technology
- DDR4-2133 ECC or non-ECC memory SO-DIMM, up to 32GB
- 4 x 1GbE RJ45 & 2 x 1GbE RJ45 for DTA 1162A
- 4 x 1GbE RJ45 & 2 x 1GbE SFP for DTA 1162B
- 1 x M.2 2242 storage socket
- On-board 8GB eMMC 5.0
- 2 x USB 3.0 connector
- TPM 1.2/2.0
| Main Board | DTB1162 seriesIntel Atom® processor C3338 w/o Intel® QAT for DTA 1162AIntel Atom® processor C3558 w/ Intel® QAT for DTA 1162B |
| Main Memory | 1 x DDR4-1866 SO-DIMM ECC/non- ECC memory for DTA 1162A, up to 16GB1 x DDR4-2133 SO-DIMM ECC/non- ECC memory for DTA 1162B, up to 32GB |
| LAN Features | 4 x 1GbE RJ45 (88E1543) & 2 x 1GbE RJ45(Intel® I211) for DTA1162A4 x 1GbE RJ45 (88E1543) & 2 x 1GbE SFP (Intel® I210) for DTA1162BSupport 10/100/1000 link speed |
| Expansion | 1 x M.2 2230 for Wi-Fi module (E-Key)1 x M.2 3042 for LTE module with SIM slot on-board (B-Key) |
| I/O Interface-Front | Power/System/HDD/LAN LEDs1 x SIM slot |
| I/O Interface-Rear | 1 x DC-in1 x Power button2 x USB 3.01 x RJ45 type console port1 x Reset button3 x SMA connector holes for RF cable |
| Storage Device | 1 x 8GB eMMC1 x M.2 2242 M-key socket (SATA) |
| Power Input | DC 12V/3.33A 40W power adaptor |
| Dimensions | Chassis dimension (mm): 225 x 150 x 44Carton dimension (mm): 275 x 230 x 185 |
| Weight | Without packing: 1.5kgWith packing: 2.5kg |
| Environment | Operating temperatures: 0°C~40°CStorage temperature: -20°C~80°CRelative humidity: 10%~90% non-condensing |
| Certifications | CE ApprovalFCC Class B |
DTA1162
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- Intel Atom® processor C3000 series SoC, BGA type
- Support Intel® QuickAssist Technology
- DDR4-2133 ECC or non-ECC memory SO-DIMM, up to 32GB
- 4 x 1GbE RJ45 & 2 x 1GbE RJ45 for DTA 1162A
- 4 x 1GbE RJ45 & 2 x 1GbE SFP for DTA 1162B
- 1 x M.2 2242 storage socket
- On-board 8GB eMMC 5.0
- 2 x USB 3.0 connector
- TPM 1.2/2.0